Pruek Vanna-iampikul, Ph.D.

Lecturer, Department of Electrical Engineering, Burapha University
Email: pruek.va@eng.buu.ac.th
CV  |  Google Scholar

Welcome to my personal website!
I am a Lecturer in the Department of Electrical Engineering at Burapha University, Thailand. I earned my Ph.D. in Electrical and Computer Engineering from the Georgia Tech Computer-aided Design Lab (GTCAD), under the supervision of Prof. Sung Kyu Lim. I earned my M.Eng. in Microelectronics and Embedded Systems from the Asian Institute of Technology and my B.Eng. in Computer Engineering from King Mongkut's Institute of Technology Ladkrabang. My research focuses on VLSI physical design, 3D integrated circuits, chiplet and interposer integration, and machine learning for Electronic Design Automation (EDA).

Experience



2024 — Present

Lecturer, Department of Electrical Engineering, Burapha University
June 2024 — Present

  • Teach undergraduate courses on Integrated Circuit Design, Computer Programming, and Electrical Engineering fundamentals.
  • Conduct research in VLSI physical design, 3D ICs, and ML for EDA.


2023

Technical Intern, Electronic Design Automation Group (EDAG), Synopsys Inc.
June 2023 — December 2023

  • Developed methodologies and tools within the EDA group for advanced physical design flows.


2019 — 2024

Graduate Research Assistant, Georgia Tech CAD Laboratory
August 2019 — May 2024

  • Conducted Ph.D. research on monolithic 3D ICs, glass interposers, chiplet integration, back-side power delivery, and ML-based EDA.
  • Published in DAC, ICCAD, ISPD, TCAD, TODAES, and VLSI Symposium.


2017 — 2019

Research Associate, AI Center, Asian Institute of Technology
June 2017 — July 2019

  • Worked on AI and computer vision research projects at the AIT AI Center.


2012 — 2015

Embedded System Software Developer, AKCP Co., Ltd.
June 2012 — April 2015

  • Developed embedded systems software for environmental and infrastructure monitoring products.

Education


2024

Ph.D. in Electrical and Computer Engineering
Georgia Institute of Technology
Advised by Prof. Sung Kyu Lim at the Georgia Tech CAD Laboratory (GTCAD).
Research areas: 3D ICs, glass interposers, back-side PDN, ML-driven physical design.

2017

M.Eng. in Microelectronics and Embedded Systems
Asian Institute of Technology
ERASMUS+ exchange master program at Universidade de Minho, Portugal (September 2016 — March 2017).

2012

B.Eng. in Computer Engineering
King Mongkut's Institute of Technology Ladkrabang
Senior project grant from the Engineering Department on "IPSC Training System" (~100,000 THB, 2011).

Publications

Refereed Journal Publications

TCAD
2025

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
P. Vanna-Iampikul et al.,
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 5, pp. 1954-1967, May 2025.

TODAES
2026

A Hybrid Reinforcement Learning Framework for Efficient Physical Design Parameter Tuning
H. H. Hsiao, Y. C. Lu, P. Vanna-Iampikul, and S. K. Lim,
ACM Transactions on Design Automation of Electronic Systems (TODAES), 2026.

TODAES
2023

GNN-based Multi-bit Flip-flop Clustering and Post-Clustering Design Optimization for Energy-Efficient 3D ICs
P. Vanna-Iampikul, Y.-C. Lu, D. E. Shim, and S. K. Lim,
ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 28, no. 5, pp. 1-26, 2023.

IJHPCA
2023

Abisko: Deep Codesign of an Architecture for Spiking Neural Networks using Novel Neuromorphic Materials
J. S. Vetter, P. Date, F. Fahim, S. R. Kulkarni, P. Maksymovych, A. A. Talin, M. G. Tallada, P. Vanna-Iampikul, A. R. Young, D. Brooks, and Y. Cao,
The International Journal of High Performance Computing Applications, 37(3-4), pp. 351-379, 2023.

TCAD
2022

Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs
P. Vanna-Iampikul, C. Shao, Y.-C. Lu, S. Pentapati, Y. Heo, J.-S. Choi, and S. K. Lim,
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 7, pp. 2331-2335, 2022.

JETC
2021

Design Automation and Test Solutions for Monolithic 3D ICs
L. Zhu, A. Chaudhuri, S. Banerjee, G. Murali, P. Vanna-Iampikul, K. Chakrabarty, and S. K. Lim,
ACM Journal on Emerging Technologies in Computing Systems (JETC), vol. 18, no. 1, pp. 1-49, 2021.
Refereed Conference Publications

ASP-DAC
2026

Boosting Scalability and Performance: Macro Placement for Flexible 3D-Stacked ML Accelerators
J. Hu, C. Zhang, P. Vanna-Iampikul, T. Krishna, and S. K. Lim,
31st Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 979-985, 2026.

ICCAD
2025

Closing the Gap: Advantages of Block-Level over Gate-Level in 3D IC Design for Advanced Nodes
M. G. Park, P. Vanna-Iampikul, and S. K. Lim,
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 1-9, October 2025.

DAC
2025

DCO-3D: Differentiable Congestion Optimization in 3D ICs
H.-H. Hsiao, Y.-C. Lu, P. Vanna-Iampikul, A. Agnesina, R. Liang, Y.-H. Lu, H. Ren, and S. K. Lim,
62nd ACM/IEEE Design Automation Conference (DAC), 2025.

DAC
2025

GNN-MLS: Signal Routing in Mixed-Node 3D ICs through GNN-Assisted Metal Layer Sharing
J. Hu, P. Vanna-Iampikul, Z. Zhuang, T.-Y. Ho, and S. K. Lim,
62nd ACM/IEEE Design Automation Conference (DAC), 2025.

iEECON
2025

2D LiDAR-Based Eucalyptus Tree Measurement and Monitoring System using Mobile Application
P. Vanna-iampikul, V. Boonnateephisit, S. Limsoontharakul, J. Moonrinta, M. N. Dailey, and M. Ekpanyapong,
13th International Electrical Engineering Congress (iEECON), 2025.

ISPD
2025

Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs
P. Vanna-iampikul, J. Yoon, C. Park, G. Yeap, and S. K. Lim,
2025 International Symposium on Physical Design (ISPD), pp. 200-208, 2025.

ICCAD
2025

AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality
S. Woo, P. Vanna-iampikul, and S. K. Lim,
43rd IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Article 140, pp. 1-9, 2025.

ICCAD
2025

Spiking Transformer Hardware Accelerators in 3D Integration
B. Xu, J. Hwang, P. Vanna-iampikul, S. K. Lim, and P. Li,
43rd IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Article 229, pp. 1-9, 2025.

DAC
2024

ML-based Physical Design Parameter Optimization for 3D ICs: From Parameter Selection to Optimization
H.-H. Hsiao, P. Vanna-Iampikul, Y.-C. Lu, and S. K. Lim,
61st ACM/IEEE Design Automation Conference (DAC), pp. 1-6, 2024.

DAC
2024

GNN-assisted Back-side Clock Routing Methodology for Advanced Technologies
N. E. Bethur, P. Vanna-Iampikul, O. Zografos, L. Zhu, G. Sisto, D. Milojevic, A. García-Ortiz, et al.,
61st ACM/IEEE Design Automation Conference (DAC), pp. 1-6, 2024.

VLSI
2024

Back-side Design Methodology for Power Delivery Network and Clock Routing
P. Vanna-iampikul, H. Yang, J. Kwak, J. X. Hu, A. Rahman, N. E. Bethur, C. Hao, S. Yu, and S. K. Lim,
2024 IEEE Symposium on VLSI Technology and Circuits, pp. 1-2, 2024.

ISPD
2024

FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning
H.-H. Hsiao, Y.-C. Lu, P. Vanna-Iampikul, and S. K. Lim,
2024 International Symposium on Physical Design (ISPD), pp. 93-101, 2024.

DAC
2023

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
P. Vanna-Iampikul, L. Zhu, S. Erdogan, M. Kathaperumal, R. Agarwal, R. Gupta, K. Rinebold, and S. K. Lim,
60th ACM/IEEE Design Automation Conference (DAC), pp. 1-6, 2023.

ISCAS
2023

A 3D Implementation of Convolutional Neural Network for Fast Inference
N. R. Miniskar, P. Vanna-Iampikul, A. Young, S. K. Lim, F. Liu, J. Yoo, C. Mills, N. Tran, F. Fahim, and J. S. Vetter,
2023 IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1-5, 2023.

ISPD
2021

Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs
P. Vanna-Iampikul, C. Shao, Y.-C. Lu, S. Pentapati, and S. K. Lim,
2021 International Symposium on Physical Design (ISPD), pp. 39-46, 2021.

ICCAD
2020

RTL-to-GDS Design Tools for Monolithic 3D ICs
J. Kim, G. Murali, P. Vanna-Iampikul, E. Lee, D. Kim, A. Chaudhuri, S. Banerjee, K. Chakrabarty, S. Mukhopadhyay, and S. K. Lim,
39th International Conference on Computer-Aided Design (ICCAD), pp. 1-8, 2020.

I-SEEC
2012

IPSC Training System
C. Vongchumyen, P. Vanna-iampikul, and A. Mongkonrat,
4th International Science, Social Science, Engineering and Energy Conference (I-SEEC), pp. 131-134, 2012.

Teaching


Burapha

Integrated Circuit Design by FPGA and VHDL
Elective senior-year course, Embedded System and Electronic Communication Program.

Burapha

Computer Programming for Engineering
Required freshman course, multiple engineering majors.

Burapha

Fundamental of Electrical Engineering Laboratory
Required freshman course, multiple engineering majors.

Honors, Awards & Services


2018

Royal Thai Government Scholarship
Recipient for the postgraduate program (fully funded).

2016 — 2017

ERASMUS+ Scholarship
Recipient for the exchange master program at Universidade de Minho, Portugal.

2012

Second Place, 14th National Software Contest (NSC2012)
Linux Application category, topic "IPSC Training System," at Impact Arena Mueng Thong Thani.

2011

Senior Project Grant
~100,000 THB from the Engineering Department on the topic "IPSC Training System."

2024 — Present

Member, Undergraduate Curriculum Committee
Embedded System and Electronic Communication Program, Department of Electrical Engineering, Burapha University (September 2024 — present).

2025 — 2026

Trainer, Backend TESA — Train the Trainer
RISC-V SoC Project by TESA (December 2025 — January 2026).